TOCOBO Cica Cooling Stick

TOCOBO Cica Cooling Stick (18g)

A lightweight cooling stick designed for convenient daily care and effortless reapplication throughout the day. Formulated with Centella Asiatica, Aloe-derived soothing ingredients, and a 10-type Hyaluronic Acid Complex, it helps calm redness, replenish moisture, and keep skin feeling fresh and comfortable. The smooth balm texture glides on easily without leaving a greasy finish, making it ideal for all skin types, including sensitive and acne-prone skin.

Key Benefits

• Cooling & Soothing – Centella Asiatica and Aloe-derived ingredients help calm redness and overheated skin.
• Deep Hydration – Infused with a 10-type Hyaluronic Acid Complex to deliver lasting moisture and support the skin barrier.
• Lightweight & Non-Greasy – Smooth balm texture absorbs comfortably without stickiness or residue.
• Easy Reapplication – Portable stick format glides effortlessly over bare skin or makeup for quick touch-ups anytime.

How to Use
As the final step of your morning skincare routine, glide the stick evenly over the face and neck. Reapply as needed.

Ingredients
Water, Coco-Caprylate/Caprate, Synthetic Wax, Dibutyl Adipate, Butyloctyl Salicylate, Butylene Glycol, Diethylamino Hydroxybenzoyl Hexyl Benzoate, Ethylhexyl Triazone, Ozokerite, Caprylic/Capric Triglyceride, Niacinamide, Dimethicone, Polymethylsilsesquioxane, Polysilicone-15, Bis-Ethylhexyloxyphenol Methoxyphenyl Triazine, Centella Asiatica Root Extract, Centella Asiatica Leaf Extract, Centella Asiatica Extract, Sodium Hyaluronate, Stearalkonium Hectorite, Glyceryl Caprylate, Caprylyl Glycol, Ethylhexylglycerin, Adenosine, Tocopherol, Saccharomyces Ferment, Asiaticoside, Madecassoside, Dimethylsilanol Hyaluronate, Hydrolyzed Sodium Hyaluronate, Hydrolyzed Hyaluronic Acid, Potassium Hyaluronate, Hyaluronic Acid, Sodium Hyaluronate Crosspolymer, Hydroxypropyltrimonium Hyaluronate, Sodium Hyaluronate Dimethylsilanol, Sodium Acetylated Hyaluronate, Madecassic Acid, Asiatic Acid, Fragrance, Chromium Oxide Greens.